IPSCO finalizes plate heat treating location, supplier

December 7, 2004

IPSCO Inc. has selected Mobile, Ala., as the location to build its new continuous plate heat treating operation. It has awarded LOI Inc., Pittsburgh, the major contract for designing and supplying equipment.

The $45 million facility will produce 170,000 tons per year of heat-treated plate, quenched and tempered or normalized, ranging in thickness from 3/16 in. to 3 in. at widths up to 123 in. The 140,000-sq.-ft. greenfield site facility will include a shot blast station, hot leveler, stenciler, and shear, all fully automated.

As part of the contract, LOI Thermprocess, Essen, Germany, will provide furnace and quench process technology.

Based on agreed schedules, the normalizing line is expected to begin operations in the fourth quarter of 2005 and the quench and temper unit in the first quarter of 2006.

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