Laser cutting technology designed for quick, clean piercing in various materials

January 10, 2006

Bystronic's Controlled Pulse Pierce (CPP) technology for laser cutting systems is designed to generate fast, clean piercing in a range of material types and thicknesses.

The two-stage pulse piercing method pierces through the initial surface in stage one and then switches to a second stage where the intensity of the pulse is increased. In stage two the system employs a cut monitoring device that determines when the pierce-through has been achieved. When the cut monitor detects completion, the cutting motion is initiated.

The method helps reduce heat input from the smaller entry, eliminate material accumulation on the plate surface, and reduce pierce-through times. The technology now is standard on the Bystar and Byspeed 5,200- and 4,400-W laser cutting systems.

Related Companies