July 26, 2010
Miyachi Unitek Corp. has introduced the Uniflow3 power supply for resistance soldering, heat sealing, and conductive adhesive bonding applications. It replaces the Uniflow2 power supply and features hardware improvements, new process control features, upgraded limit and alarm options, and user interface upgrades.
Using pulsed heat technology, the power supply provides targeted heating and precision temperature control for such components as flex circuits, ribbon cables, wires, SMT components, single- or dual-sided edge connectors, and thermocompression bonding of gold ribbon.
The GUI provides a picture of the process status and results, and the added user-settable process segments enable the machine to output heating profiles.
The LCD is twice the height as it was in the previous model, with a new front panel keypad containing additional keys for access to new features. Process control features now include three additional heating stages and added states for programmable relays. The machine also includes new postheat functions, as well as a fully functional idle heat function with a warm-up that features a slow ramp-up of temperature to idle after power-up.
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