Thermally conductive silicone encapsulant designed for high-heat dissipation applications

January 3, 2011

Thermally conductive silicone encapsulant designed for high-heat dissipation applications - TheFabricator.com

Lord Corp. has announced the availability of a new thermally conductive silicone encapsulant. Designed for encapsulation applications in which high heat dissipation is required, SC-305 is a two-component silicone system.

Suitable for LED lighting power supply encapsulation, the encapsulant can be used at room temperature or heat cured for maximum adhesion. According to the firm, the product delivers low stress, high thermal conductivity, and superior environmental resistance.

The encapsulant is composed of an addition-curing polymer that will not depolymerize when heated in confined spaces. It also meets the flame-retardancy requirements of UL 94 V-O. The three-step application process involves mixing, applying, and curing.



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