Lumidize aluminum electroplating process from LumiShield is phosphate-free, primer-free

LumiShield Technologies has introduced a new aluminum electroplating process called Lumidize™ as an alternative to common surface preparation technologies based on heavy metals and phosphates.

This proprietary aqueous process plates aluminum oxide onto any conductive substrate. The resultant electroplate (0.1 mil or less) forms a hard barrier layer that helps maximize the adhesion of organic materials and improve corrosion resistance.

The process binds to any conductive material, particularly carbon steels. Those surfaces then chemically bind to epoxy and urethane topcoats without the need for phosphate or primer. The process is compatible with pulse and DC systems and can be optimized with temperature, pH, current density, and additive packages for fine control of coating properties.