Nanotech material splitting technology developed

May 20, 2014

Fonon Technologies Intl. has developed an industrial process known as Zero Width Laser Cutting Technology™ (ZWLCT™).

The technique uses a laser-controlled Power Density profile on the material surface to generate subsurface forces greater than intermolecular connections. The methodology uses a noncontact laser-induced internal stress to produce a controlled separation that eliminates surface degradation associated with mechanical scribe and break. Yield loss from particulate damage also is reduced.

The technique facilitates cutting substrates in clean room conditions, which makes it possible to introduce a production line concept into clean room substrate manufacturing.



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