Optomec teams with Lockheed and GE to secure NextFlex contract award

Optomec, supplier of production-grade AM systems for 3-D printed metals and electronics based in Albuquerque, N.M., in partnership with Lockheed Martin, Binghamton University, GE, Intrinsiq Materials, and the University of Maryland, has been awarded one of five development projects from NextFlex®.

Formed through a cooperative agreement between the U.S. Department of Defense and FlexTech Alliance, NextFlex is a consortium of companies; academic institutions; nonprofits; and state, local, and federal governments with a shared goal of advancing U.S. manufacturing of flexible hybrid electronics (FHE). FHE is a new class of lightweight, low-cost, flexible, stretchable, conformable, and efficient devices for the Internet of Things (IoT), medical, robotics, and communication markets.

The project, entitled “Conformal Printing of Conductor and Dielectric Materials onto Complex 3D Surfaces,” has a total value of $3.1 million. The total cost-shared value of contracts from all NextFlex project calls to date is $45 million for bringing FHE mainstream.

The goal of the project is to enable conformal printing of conductor and dielectric materials on complex 3-D surfaces by advancing tooling, software, and printing processes. Optomec’s contribution includes the upfront delivery of two Pilot Line systems to be installed at the NextFlex Technology Hub in San Jose, Calif., and in New York using Optomec Aerosol Jet 5-axis printing systems. Additional existing Aerosol Jet systems will be made available at a number of the team member facilities.

Advanced toolpath-generation software will enable the project team to print conformal circuitry at resolutions to 10 microns onto 3-D surfaces using the 5-axis printing systems. As a result, Lockheed, the project lead, will deliver conformal sensors, 3-D antenna structures, and nonplanar circuit routing demonstrators.