Ultrasonic bearing from ZS-Handling allows contactless handling of small parts

As demand increases for smaller and more powerful processors, manufacturers of these products look for new techniques for stacking very thin wafers and chips. The materials are flexible, fragile, and wavy and often have specially treated surfaces, causing problems with conventional handling systems.

ZS-Handling offers a patented ultrasonic bearing that allows substrates to float evenly on an air film generated by vibrations, allowing contact-free handling. The ultrasonic movement of the sonotrode creates a supporting gas film between the sonotrode surface and the substrate. The substrate floats on the resulting gas film at distances of 10 to 150 μm, depending on the application. In special cases, higher hovering heights can also be achieved.

The vibrations are not transmitted into the substrates and do not lead to any impairment of the material.